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Smart Terminal
Rigid Materials
RF Materials
Automotive Materials
Flexible Materials
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IMS and HTC materials
Special Materials
HSD Materials
- HDI
- HDI
- Smart Terminal
- IC Substrate
- Thermosetting Resin Type
- Hydrocarbon Laminate
- PTFE Type
- Thermal Conductive CEM-3
- Thermal Conductive CEM-1
- Other
- Thermal Conductive FR-4.0
- Copper Base CCL
- Al Base CCL
- Ultra-low Loss Material
- Very Low-loss Material
- Low-loss Material
- Mid-loss Material
- Automotive materials
- CEM-1
- CEM-3, CEM-3.1
- Halogen Free and Lead Free Compatible FR-4.1, FR-15.1
- Lead Free Compatible FR-4.0, FR-15.0
- Conventional FR-4
- Flexible copper clad laminate
- Coverlay
- No-flow prepreg
- Stiffener
- Bonding film
- PET laminated busbar
- Rigid Polyimide Material
- Semi-flex Material
- Special Bonding Prepreg
- RCC
- Rigid Materials
- RF Materials
- Automotive Materials
- Flexible Materials
- IC Substrate Materials
- IMS and HTC materials
- Special Materials
- HSD Materials
- 不流動P片
- 其它
- 超低介質(zhì)損耗
- 低介質(zhì)損耗
- 疊層母排用絕緣膠膜
- CEM-1
- CEM-3, CEM-3.1
- PTFE Type
- 熱固性樹脂體系
- 硬質(zhì)聚酰亞胺材料
- 半撓性材料
- 特種粘合材料
- 中等介質(zhì)損耗
- 鋁基板
- 銅基板
- 撓性覆銅板
- 覆蓋膜
- 膠膜
- 補強板
- 常規(guī)FR-4.0
- 無鉛兼容FR-4.0, FR-15.0
- 無鹵無鉛兼容FR-4.1, FR-15.1
- IC Substrate
- 涂樹脂銅箔
- 碳?xì)湎盗挟a(chǎn)品
- 導(dǎo)熱FR-4.0
- 汽車產(chǎn)品
- 智能終端產(chǎn)品
- 常規(guī)剛性產(chǎn)品
- 汽車產(chǎn)品
- 射頻與微波材料
- 金屬基板與高導(dǎo)熱產(chǎn)品
- IC封裝產(chǎn)品
- 軟性材料產(chǎn)品
- 高速產(chǎn)品
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- HDI
- HDI
- UL File (Download)
- IC Substrate
- Thermosetting Resin Type
- Hydrocarbon Laminate
- PTFE Type
- Thermal Conductive CEM-3
- Thermal Conductive CEM-1
- Other
- Thermal Conductive FR-4.0
- Copper Base CCL
- Al Base CCL
- Ultra-low Loss Material
- Very Low-loss Material
- Low-loss Material
- Mid-loss Material
- Automotive materials
- Conventional FR-4
- Lead Free Compatible FR-4.0, FR-15.0
- Halogen Free and Lead Free Compatible FR-4.1, FR-15.1
- CEM-3, CEM-3.1
- CEM-1
- Flexible copper clad laminate
- Coverlay
- No-flow prepreg
- Stiffener
- Bonding film
- PET laminated busbar
- Rigid Polyimide Material
- Semi-flex Material
- Special Bonding Prepreg
- RCC
- 臺灣
- 東莞
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- 咸陽
- 韓國
- 歐洲
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- 美國森林大道
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- 常熟
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- 九江
- 研發(fā)及工程化對外業(yè)務(wù)
- 委托測試對外業(yè)務(wù)
- 知識產(chǎn)權(quán)和標(biāo)準(zhǔn)對外業(yè)務(wù)
- 人才培養(yǎng)和技術(shù)培訓(xùn)
- CQC Certificate
- BSI Certificate
- JET Certificate
- VDE Certificate
- UL File (UL IQ link)
- Education
- Environmental Protection
- Society
- Shengyi Technology
- Shaanxi Shengyi
- Suzhou Shengyi
- Changshu Shengyi
- Jiangsu Shengyi
- Jiangxi Shengyi
- Hong Kong Shengyi
- Taiwan Shengyi
- 資教助學(xué)
- 環(huán)?；顒?/a>
- 回饋社會
- 廣東生益
- 陜西生益
- 蘇州生益
- 常熟生益
- 江蘇生益
- 江西生益
- 香港生益
- 臺灣生益
- 臺灣
- PTFE Type
- 熱固性樹脂體系
- 硬質(zhì)聚酰亞胺材料
- 半撓性材料
- 特種粘合材料
- 中等介質(zhì)損耗
- 低介質(zhì)損耗
- 超低介質(zhì)損耗
- 撓性覆銅板
- 覆蓋膜
- 不流動P片
- 膠膜
- 補強板
- 疊層母排用絕緣膠膜
- 東莞
- 蘇州
- 咸陽
- 韓國
- 歐洲
- 美國中北大道
- 美國森林大道
- 日本
- 東莞萬江
- 咸陽
- 蘇州
- 常熟
- 南通
- 九江
- 東南亞
- 巴西
- 常規(guī)FR-4.0
- 無鉛兼容FR-4.0, FR-15.0
- 無鹵無鉛兼容FR-4.1, FR-15.1
- CEM-1
- CEM-3, CEM-3.1
- IC Substrate
- 涂樹脂銅箔
- 碳?xì)湎盗挟a(chǎn)品
- 鋁基板
- 銅基板
- 導(dǎo)熱FR-4.0
- 其它
- UL檔案
- UL認(rèn)證（查詢）
- CQC認(rèn)證
- BSI認(rèn)證
- JET認(rèn)證
- VDE認(rèn)證
- 三會規(guī)則
- 工作制度
- 內(nèi)部控制
- 研發(fā)及工程化對外業(yè)務(wù)
- 委托測試對外業(yè)務(wù)
- 知識產(chǎn)權(quán)和標(biāo)準(zhǔn)對外業(yè)務(wù)
- 人才培養(yǎng)和技術(shù)培訓(xùn)
- 聯(lián)系方式
- 汽車產(chǎn)品
- HDI
- Smart Terminal
- IC Substrate
- Thermosetting Resin Type
- Hydrocarbon Laminate
- PTFE Type
- Thermal Conductive CEM-3
- Thermal Conductive CEM-1
- Other
- Thermal Conductive FR-4.0
- Copper Base CCL
- Al Base CCL
- Ultra-low Loss Material
- Very Low-loss Material
- Low-loss Material
- Mid-loss Material
- Automotive materials
- CEM-1
- CEM-3, CEM-3.1
- Halogen Free and Lead Free Compatible FR-4.1, FR-15.1
- Lead Free Compatible FR-4.0, FR-15.0
- Conventional FR-4
- Flexible copper clad laminate
- Coverlay
- No-flow prepreg
- Stiffener
- Bonding film
- PET laminated busbar
- Rigid Polyimide Material
- Semi-flex Material
- Special Bonding Prepreg
- RCC
- Rigid Materials
- RF Materials
- Automotive Materials
- Flexible Materials
- IC Substrate Materials
- IMS and HTC materials
- Special Materials
- HSD Materials
Input specification value filtering
Product List
- product name
- Product brief description
- CTI
- Thermal conductivity（W/m·K）
- Df/10GHz
- Dk/10GHz
- application area
- Dk
- Df
- CTE
- Tg
- Td
- SF206B
- LowDk/Df Bonding film
- --
- --
- 0.003
- 2.5
- 5G
- --
- --
- --
- --
- --
- SF315B
- Halogen-free type epoxy bonding film
- --
- --
- 0.02
- 3.4
- Multilayer Module Rigid-Flex Module
- --
- --
- --
- --
- --
- SF325B
- Anti-ion Migration type bonding film
- --
- --
- 0.017
- 3.4
- --
- --
- --
- --
- --