On September 5, 2019, IEC TC91 WG10 convener Mr. Cai Jianwei led main R&D engineer Mr. Wang Qing, and standardization engineer Mr. Liu Shenxing, and Suzhou Shengyi Standardization Department Chief Mr. Luo Penghui, standardization engineer Mr. Yuan Gao and testing engineer Mr.Wang Jun co-organized the domestic argument meeting of two IEC standard proposals. The two standard proposals are, Cover film for IC carrier by SYTECH,and XY-CTE testing method (TMA probe method) of CCL by Suzhou Shengyi. Many authoritative experts in the domestic PCB industry examined the two proposals, and all agreed that the two IEC standard proposals passed domestic argument.

In recent years, SYTECH’s international standardization work has stepped into a new stage. SYTECH accelerates its pace in applying for international standards, enhances communication and cooperation with standardization committees in SYTECH group to give play to its advantages of group company. In the future, SYTECH will continue to enhance its influence in the domestic and international standard circles.